YS-2-001 適用于環(huán)氧樹脂固化體系的潛伏性固化劑
Latent curing agent suitable for epoxy resin curing systems
YS-2-001 is a latent curing agent suitable for epoxy resin curing systems, designed specifically for single component systems. The difference between it and the current low-temperature latent curing agent is that the minimum curing temperature can reach 80 ℃. Its advantages are good product compatibility, easy solubility in epoxy resin, and convenient use. Its easy solubility in water allows it to be formulated and used with waterborne epoxy resins.
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